PTC Engineer Publishes Via Hole Punching Analysis

Analysis of Via Hole Punching on LTCCVahdat Chee, a PTC Mechanical Design Engineer, has co-written and published a research paper that analyzes the micro complex shape via hole punching on Low-Temperature Co-Fired Ceramics (LTCC)

The paper was published in the New Journal of Glass and Ceramics and can be accessed here.

Related PTC Product: Automatic Ceramic Punch System