Via Filler

Thin lineVia Filler
Fea­tures:

  • Fill small via hole com­plete­ly
  • Full vision align­ment sys­tem and a broad process lat­i­tude
  • Air pres­sure fills all holes uni­form­ly
  • Air­tight via fill ink
  • Abil­ity to fill fired sub­strates
  • Option: auto­mat­ic vision align­ment

Fill Small Vias In Green Ceram­ic Tape and Fired Sub­strates With Pres­sure Injec­tion

Pacif­ic Tri­net­ics Corporation’s VM Series Via Fill Sys­tem with it’s Vision Align­ment Sys­tem address­es the need to fill small vias uni­form­ly with­out mis­reg­is­tra­tion or over­fill­ing. The VM Series patent­ed process is capa­ble of fill­ing vias as small as 0.002” (0.05 mm) in ceram­ic tape, fired sub­strates and var­i­ous oth­er micro­elec­tron­ics mate­ri­als up to 12″ (304 mm) square in size.

Unlike screen print­ing, the Via Fill­ing does not use a vac­u­um to assist in the fill­ing process, min­i­miz­ing the chance of a par­tial fill that can occur when attempt­ing to fill very small vias. Also unlike screen print­ing, via ink in the Via fill­ing is not con­tin­u­al­ly exposed to air which pre­vents the evap­o­ra­tion of sol­vents in the ink and main­tains a con­stant vis­cos­i­ty from the first part to the last. In the VM Series Via Fill­ing Sys­tem the via fill ink is con­tained in a blad­der-like reser­voir. When air pres­sure is applied to the blad­der it extrudes the ink through a sten­cil mask direct­ly into the vias of the part you are fill­ing.

For more infor­ma­tion, please down­load the spec­i­fi­ca­tion sheet for this prod­uct here.

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