Fill Small Vias In Green Ceramic Tape And
Fired Substrates With Pressure Injection
Pacific Trinetics Corporation’s VF-1000 Via Fill System addresses the need to fill small vias uniformly without mis-registration or overfilling. The VF-1000’s patented process is capable of filling vias as small as 2 mils (50 mm) in ceramic tape, fired substrates and various other microelectronics materials up to 8" (203mm) square in size. Unlike screen printing, the VF-1000 does not use vacuum to assist in the filling process, minimizing the chance of a partial fill that can occur when attempting to fill very small vias. Also unlike screen printing, via ink in the VF-1000 is not continually exposed to air which prevents the evaporation of solvents in the ink and maintains a constant viscosity from the first part to the last. In the VF-1000 the via fill ink is contained in a bladder-like reservoir. When air pressure is applied to the bladder it extrudes the ink through a stencil mask directly into the vias of the part you are filling. The mask is registered to the part using the same tooling pins that are positioning the part on the vacuum stage. The ink forced into the vias naturally displaces any trapped air and fills all the vias in the part simultaneously. Whether you’re dissatisfied with your current via filling process or just seeking the latest technology, look to the VF-1000 Via Fill System for the solution.
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